吳翔，男，1990年4月出生，博士研究生。2020年6月畢業(yè)于中南大學(xué)材料科學(xué)與工程專(zhuān)業(yè)，獲工學(xué)博士學(xué)位。2020年8月入職長(zhǎng)沙理工大學(xué)材料科學(xué)與工程學(xué)院。
主要研究方向：
（1）高強(qiáng)高導(dǎo)耐熱銅合金的組織性能表征及其相關(guān)機(jī)理研究
（2）高性能金屬基復(fù)合材料的設(shè)計(jì)與應(yīng)用
（3）快速凝固技術(shù)的研究與應(yīng)用
參與的科研項(xiàng)目：
國(guó)家自然科學(xué)基金青年科學(xué)基金項(xiàng)目（5180041060），快速凝固高硅鋁電子封裝材料的稀土元素微合金化及強(qiáng)韌化機(jī)理研究，2019-2021，參研
近五年發(fā)表SCI期刊論文：
[1]X. Wu,R. Wang, C. Peng, Y. Feng, Z. Cai*, Effects of annealing on microstructure and mechanical properties of rapidly solidified Cu-3?wt% Ag-1?wt% Zr,Materials Science and Engineering: A, 2019, 739: 357-366.
[2] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Influence of hot isostatic pressing and forging on the microstructure and mechanical properties of Cu-3Ag-1Zr alloys, Materials & Design, 2019, 168: 107676.
[3] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Microstructures and elevated temperature properties of rapidly solidified Cu-3Ag-0.5Zr and Cu-3Ag-0.5Zr-0.4Cr-0.35Nb alloys, Journal of Alloys and Compounds. 2019, 803: 1037-1044.
[4] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Effects of cold rolling and low-temperature annealing on microstructure and mechanical properties of rapidly solidified Cu-3Ag-0.5Zr alloy,Materials Science and Engineering: A, 2020, 773: 138829.
[5]X. Wu, R. Wang, C. Peng, G. Jiang*, Microstructure stability and tensile properties of Cu-3Ag-1Zr alloy fabricated by rapid solidification and cold rolling, Materials Characterization. 2020, 160: 110091.
[6] X. Wu, R. Wang, C. Peng, J. Zeng*, Ultrafine grained Cu-3Ag-xZr (x = 0.5, 1.0 wt%) alloys with high strength and good ductility fabricated through rapid solidification and cryorolling,Materials Science and Engineering: A, 2020, 778: 139095.
[7] X. Wu, R. Wang, C. Peng, X. Wang*, Low-temperature annealing behavior and tensile properties of the rapidly solidified Cu3Ag0.5Zr0.4Cr0.35Nb alloy reinforced by cold rolling, Journal of Alloys and Compounds,2020, 828: 154371.
[8] S. Yu, R. Wang, C. Peng, Z. Cai*, X. Wu, Y. Feng, X. Wang, Effect of minor scandium addition on the microstructure and properties of Al-50Si alloys for electronic packaging, Journal of Materials Science: Materials in Electronics, 2019, 30: 20770-20777.
[9] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, H. Li, High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging,Materials Science and Engineering: A, 2018, 728: 95-101.
[10] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, H. Li, Microstructure, mechanical and thermo-physical properties of Al-50Si-xMg alloys, Materials Science and Engineering: A, 2018, 730: 57-65.
[11] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, Effect of copper content on microstructure and mechanical properties of Al/Sip composites consolidated by liquid phase hot pressing, Materials & Design, 2016, 170: 10-17.
[12] Z. Cai, C. Zhang*,R. Wang, C. Peng, X. Wu, H. Li*, M. Yang. Improvement of deformation capacity ofgas-atomized hypereutectic Al-Si alloy powder by annealing treatment, Transactions of Nonferrous Metals Society of China,2018,28(08):1475-1483.
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